In this paper, a comprehensive thermal analysis of a loudspeaker is presented using COMSOL software. The aim of this research is to investigate the effect of design variables on thermal behavior and to provide solutions for optimization and prevention of overheating. First, the temperature behavior of the loudspeaker without the presence of a fluid was investigated. The coil temperature reached 380 Kelvin after 10 minutes, which could lead to component damage. By adding a fluid (air) as the cooling medium, the temperature was reduced to 312 Kelvin, a decrease of 68 Kelvin compared to the initial condition, and only a 19-degree increase from room temperature. The effect of variables such as input voltage, number of turns, and wire diameter on temperature and resistance was examined. The results showed that a 14-Kelvin increase in coil temperature led to a 7% increase in resistance, which negatively impacted electrical performance. Increasing the number of turns and wire diameter reduced current density and improved heat dissipation. The findings indicate that by carefully tuning design variables and using cooling mechanisms, thermal efficiency can be improved, leading to increased lifespan and sound quality.
Type of Study:
Applicable |
Subject:
Physical Acoustics Received: 2024/11/2 | Accepted: 2025/02/21 | Published: 2025/03/18